Manufacturer: Winbond Electronics

Key Specifications

• Package: 8-pin SOIC-208mil
• Core: SPI NOR Flash
• Memory: 256Mbit (32MB)
• Interface: SPI/Dual SPI/Quad SPI/QPI
• Voltage: 2.7V-3.6V
• Clock: 133MHz (to be verified)
• Temperature: -40°C to +85°C

The W25Q256JVEIQ from Winbond Electronics is a high-capacity SPI NOR Flash memory device designed for applications requiring reliable code storage and data retention. With a density of 256 megabits (32 megabytes), this device provides ample space for firmware, configuration data, and file systems.

Key Features

• Memory density: 256Mbit (32MB)
• Interface: Standard SPI, Dual SPI, Quad SPI, and QPI modes
• Package: 8-pin SOIC (208-mil) for compact PCB designs
• Supply voltage: 2.7V to 3.6V, suitable for 3.3V systems
• Operating temperature range: -40°C to +85°C (industrial grade)
• High-speed clock frequency: up to 133MHz (to be verified)
• Flexible erase and program capabilities with sector, block, and chip erase
• Low power consumption for battery-powered devices

Applications

• Embedded systems and IoT devices
• Consumer electronics (smart TVs, set-top boxes)
• Networking equipment (routers, switches)
• Industrial control and automation
• Automotive electronics (infotainment, telematics)
• Medical devices and wearable technology

Selection Guidance

When selecting the W25Q25Q256JVEIQ, consider the required memory density, interface compatibility, and operating voltage. The device's SOIC-208mil package is suitable for standard PCB assembly. For high-speed applications, verify the maximum clock frequency with the official datasheet. This product is a drop-in replacement for many standard SPI NOR Flash devices with similar pinouts, but always confirm the exact specifications with the manufacturer.