Manufacturer: Winbond Electronics

Key Specifications

• Package: WSON-8 (8x6mm)
• Core: NAND Flash
• Memory Size: 1Gbit (128MB)
• Interface: SPI (Standard/Dual/Quad)
• Voltage: 2.7V-3.6V
• Temperature: -40°C to +85°C (industrial grade)
• Clock Frequency: 104MHz (max)
• Page Size: 2048+64 bytes

The W25N01GVZEIG from Winbond Electronics is a high-density SPI NAND flash memory device designed for applications requiring reliable, non-volatile data storage. With a capacity of 1Gbit (128MB), this device provides ample space for code shadowing, data logging, and file storage in embedded systems.

Key Features

• Memory architecture: NAND flash with 2048-byte page size plus 64-byte spare area
• Interface: Standard SPI, Dual SPI, and Quad SPI with clock rates up to 104MHz
• Supply voltage: 2.7V to 3.6V, suitable for 3.3V systems
• Package: Compact 8-pin WSON (8x6mm) for space-constrained designs
• Temperature range: Industrial grade (-40°C to +85°C) for harsh environments
• Reliability: Built-in error correction code (ECC) support and bad block management
• Endurance: To be verified (typical NAND endurance applies)

Applications

• Embedded systems requiring high-capacity storage
• IoT devices and smart sensors
• Industrial control and automation
• Networking equipment (routers, switches)
• Set-top boxes and digital media players

Selection Guidance

The W25N01GVZEIG is suitable for designs where SPI NOR flash capacity is insufficient and where a simple SPI interface is preferred over parallel NAND. Verify compatibility with your host controller's SPI NAND support, including ECC and bad block handling. For lower density needs, consider other W25N series devices; for higher density, check Winbond's larger NAND options.