Manufacturer: NXP Semiconductors

Key Specifications

• Package: 320-LFBGA
• Core: ARM926EJ-S
• Architecture: 16/32-bit
• Memory: ROMless, external memory interface
• Interface: USB, UART, SPI, I2C, etc.
• Voltage: 1.2V core, 3.3V I/O (typical, to be verified)
• Temperature: -40 to +85°C (industrial, to be verified)

The LPC3180FEL320-01-5 is a 16/32-bit microcontroller from NXP Semiconductors, built around the ARM926EJ-S core. It is a ROMless device, meaning program code is executed from external memory, offering flexibility for system designers. The MCU is housed in a 320-pin LFBGA (Low-profile Fine-pitch Ball Grid Array) package, suitable for compact and high-density applications.

Key Features

• ARM926EJ-S processor core with 16/32-bit instruction set support
• ROMless architecture, enabling external flash or SRAM boot
• Rich set of peripherals including USB, UART, SPI, I2C, and GPIO
• External memory interface for SDRAM, SRAM, and flash devices
• Operating voltage range: core 1.2V, I/O 3.3V (typical, to be verified)
• Industrial temperature range (to be verified)
• 320-LFBGA package for space-constrained designs

Applications

This microcontroller is suited for industrial control, consumer electronics, and communication modules where external memory is preferred. Typical uses include point-of-sale terminals, networking equipment, and embedded computing platforms.

Selection Guidance

When selecting the LPC3180FEL320-01-5, consider the need for external memory components and the required I/O voltage levels. For detailed electrical specifications and design resources, refer to the official NXP datasheet and application notes.