Manufacturer: Broadcom

Key Specifications

• Package: To be verified
• Core: To be verified
• Memory: To be verified
• Interface: To be verified
• Voltage: To be verified
• Temperature: To be verified
• Technology: DOCSIS 3.0

The Broadcom BCM33843DUKFSBGB0T is a system-on-chip (SoC) designed for cable modem and broadband gateway applications. It is part of Broadcom's DOCSIS 3.0 product family, enabling high-speed data transmission over cable networks. The device integrates a processor core, memory controller, and cable-specific PHY/MAC functions to support downstream and upstream channels, making it suitable for residential and small-business gateways.

Key Features

• DOCSIS 3.0 compliant, supporting channel bonding for enhanced throughput (exact channel counts to be verified).
• Integrated cable modem MAC/PHY and RF front-end to reduce external component count.
• Embedded processor for handling network protocols and management functions (architecture and speed to be verified).
• Support for standard memory interfaces (type and capacity to be verified).
• Multiple I/O interfaces for connectivity, such as Ethernet and USB (specifics to be verified).
• Designed for low power consumption and reliable operation in typical operating temperature ranges (exact values to be verified).

Applications

• Cable modems and eMTA (embedded Multimedia Terminal Adapter) devices.
• Residential gateways and routers with cable uplink.
• Small-office/home-office (SOHO) broadband equipment.
• IPTV set-top boxes with integrated cable modem functionality.

Selection Guidance

When selecting the BCM33843DUKFSBGB0T, designers should verify the exact package dimensions, pinout, and thermal specifications from the official datasheet. The device is intended for designs requiring DOCSIS 3.0 compliance with moderate channel bonding. For higher channel counts or DOCSIS 3.1, consider other Broadcom models. Ensure that the memory and interface configurations meet your system requirements, and consult Broadcom's design guidelines for RF front-end matching and power supply design.