Manufacturer: TDK
Key Specifications
- Package: 0201 (0603)
- Inductance: 2.5 nH
- Tolerance: ±0.1 nH (B)
- Frequency: to be verified
- DC Resistance: to be verified
- Rated Current: to be verified
- Operating Temperature: -55 to +125 °C (typical)
- Core: Multilayer ceramic (non-magnetic)
The MLG0603P2N5BT000 from TDK is a high-frequency multilayer ceramic chip inductor designed for compact RF modules and wireless communication circuits. With an inductance of 2.5 nH and tight tolerance of ±0.1 nH, it provides stable performance in impedance matching, filtering, and resonant circuits.
Key Features
- 0201 (0603) industry-standard footprint for space-constrained designs
- Multilayer ceramic construction with non-magnetic core, suitable for high-frequency operation
- Low profile and lightweight, ideal for portable devices
- Operating temperature range typically -55°C to +125°C (refer to datasheet for exact ratings)
- RoHS compliant and halogen-free
Applications
- RF front-end modules (e.g., LNA, PA matching)
- Wireless connectivity: Wi-Fi, Bluetooth, GPS, NFC
- Mobile phones, tablets, wearables
- IoT devices and sensor modules
Selection Notes
Verify the DC resistance, rated current, and self-resonant frequency against your circuit requirements. The 'B' tolerance code indicates ±0.1 nH. For detailed specifications, refer to the official TDK datasheet. Ensure proper PCB layout to minimize parasitic effects.
