Manufacturer: Winbond Electronics

Key Specifications

• Package: 8-pin SOIC (150mil)
• Core: 4M-bit (512K x 8)
• Memory: Serial Flash
• Interface: SPI (Mode 0/3)
• Voltage: 2.3V - 3.6V
• Temperature: -40°C to +85°C
• Clock Frequency: 80MHz (max)
• Density: 4Mbit

The W25X40CLSSIGS from Winbond Electronics is a 4M-bit serial flash memory device designed for a wide range of applications requiring reliable code and data storage. It operates with a single power supply voltage of 2.3V to 3.6V, making it suitable for low-power embedded systems. The device is housed in a compact 8-pin SOIC package, which is ideal for space-constrained designs.

Key Features

• Memory size: 4M-bit (512K x 8) organized as 256 bytes per programmable page
• SPI interface supporting clock frequencies up to 80MHz (maximum) with modes 0 and 3
• Low power consumption: typical active current of 5mA, standby current of 1µA (to be verified)
• Wide operating temperature range: -40°C to +85°C
• Flexible erase capability: sector erase (4KB), block erase (32KB and 64KB), and chip erase
• Page program (up to 256 bytes) and continuous read support
• Hardware write protection and software write protection features
• High reliability: 100,000 program/erase cycles (to be verified) and data retention of 20 years (to be verified)

Applications

This serial flash is commonly used in consumer electronics, IoT devices, industrial control, and communication modules for firmware storage, parameter storage, and data logging. Its small footprint and low pin count make it easy to integrate into microcontroller-based designs.

Selection Guidance

When selecting the W25X40CLSSIGS, consider the required memory density, interface speed, and operating voltage range. For applications needing higher density or different package options, Winbond offers a full portfolio of serial flash devices. Always verify the latest datasheet for exact specifications and timing parameters.